AMD

Ryzen AI 9 HX 370 Specifications

BGA12 cores / 24 threads

Released July 28, 2025

AMD's Ryzen AI 300 mobile chip: four Zen 5 cores paired with eight Zen 5c cores make 12 total and 24 threads, boosting to 5.1GHz from a 2GHz base with 24MB of L3 cache. Radeon 890M graphics and an XDNA NPU back the Strix Point silicon. The 28W figure AMD lists as default TDP is the nominal number for this design; the same page's configurable TDP spans 15W to 54W depending on chassis tuning.

Tied 7th of 23 models in the Laptop CPU catalog on Boost clock — 6 models share this figure. Tied 3rd of 23 models in the Laptop CPU catalog on L3 cache — 6 models share this figure.

Current best price

No tracked price — this page compares specifications alone.

Specifications

Cores
12
Threads
24
Socket
BGA
Boost clock
5.1 GHz
Base clock
2 GHz
Performance cores
4
Efficiency cores
8
L3 cache
24 MB
L2 cache
12 MB
TDP
28 W
Integrated graphics
Yes
Max power
54 W
Architecture
Zen 5 / Zen 5c (Strix Point)
Process node
TSMC 4nm FinFET
Integrated GPU
AMD Radeon 890M
Memory support
DDR5

Guides for this category

What owners and reviewers say

Summarised from 1 source(s), reviewed September 14, 2026. A source is counted only where it names this model exactly. How we track prices

Commonly praised

  • Reviewers ran more than 100 benchmarks and found Zen 5's power efficiency and performance compelling, with the chip often matching larger Intel and AMD parts at much lower power.
  • It combines four Zen 5 cores and eight Zen 5c cores with Radeon 890M graphics and worked well across modern Linux distributions.
  • In creator and technical workloads it frequently led performance-per-watt comparisons.

Commonly criticised

  • The Strix Point silicon still uses a 256-bit data path rather than the 512-bit path of desktop Zen 5, limiting some AVX-512-heavy workloads.

Sources behind this summary

Sources

Every spec above was pulled from one of these — a field a source didn't state was left off rather than estimated.